PCB & Neural Interface Engineer

Jun 12, 2026 I-BRAIN Nanofab

Position Summary

We are seeking a highly motivated full-time engineer to support the development of advanced neural interface systems for ultra-high-channel-count brain computer interface (BCI) platforms. The position will focus on PCB design, fabrication oversight, system integration, and testing for CMOS IC based neural recording and stimulation systems. The successful candidate will work closely with interdisciplinary teams across flexible electronics, CMOS ICs, backend electronics, and neural recording systems to help develop scalable next-generation neural interface technologies at i-BRAIN.

Key Responsibilities

  1. Hands-on PCB Design & Fabrication: Lead the end-to-end design of printed circuit boards (PCBs) tailored for IC chips, handle mixed digital/analog signal routing, including impedance-controlled routing where appropriate. Implement strict signal integrity (SI), power integrity (PI), grounding, and shielding techniques vital for microvolt-level neural signal isolation.
  2. Fabrication & Assembly Oversight: Coordinate directly with external PCB foundries and assembly vendors. Oversee fabrication quality, manage component sourcing/BOMs, and assembly process control. Ensure compliance with defined validation procedures, yield targets, and quality standards.
  3. System Testing & Bring-up: Perform rigorous board bring-up, hardware debugging, chip characterization to identify root causes and implement corrective actions. Validate system performance using oscilloscopes, logic analyzers, and custom test benches to ensure reliable data I/O routing.
  4. Next-Gen System Support: Work closely with the research team to address immediate interface and hardware integration challenges, especially preparing for incoming future high-channel-count neural interface systems.
  5. General Electronics Troubleshooting: Serve as the go-to technical expert for day-to-day lab electronics issues. Rapidly diagnose and resolve computer interface issues, data acquisition (DAQ) bottlenecks, and general hardware routing problems.

Required Qualifications

  1. BS or MS degree in Electrical Engineering or related field.
  2. Strong practical experience in PCB schematic design and layout for mixed-signal systems (e.g., using Altium Designer, Cadence Allegro, KiCad or similar tools).
  3. Experience with PCB fabrication processes, assembly workflows, and vendor coordination.
  4. Experience with board bring-up, debugging, and testing of IC-based electronic systems.
  5. Experience with characterizing signal behavior across board traces, cables, connectors, and data I/O paths, such as high-speed differential-pair waveforms, eye-diagram measurements, signal integrity, timing analysis, and robust system- level data routing.
  6. Deep understanding of analog/digital signal routing, impedance matching, grounding strategies, and EMI/noise reduction techniques.
  7. Experience with CMOS IC interfacing and high-density I/O systems is strongly preferred.
  8. Familiarity with oscilloscopes, logic analyzers, and general electronic debugging tools.
  9. Experience with FPGA, DAQ systems, or high-speed interfaces is a plus.
  10. Strong hands-on problem-solving skills and willingness to work closely with experimental researchers.
  11. Ability to work full time in a collaborative interdisciplinary environment.

How to apply

Required Materials

  1. Curriculum Vitae(in English).
  2. Any other relevant supporting documents.

Please send the above materials in PDF format to zhangxiaohang@smart.org.cn ( The subject of the email: Name + Position applied ).

Others

  1. We will arrange an interview as soon as possible after the materials are reviewed. And application materials will be kept confidential.
  2. This recruitment information is valid until the position is filled.